tgindex
Semiconductors, AI & Electronics

Semiconductors, AI & Electronics

Статистика
@SemiconductorsXанглийский

Curated insights on AI, Semiconductors, Consumer Electronics & Global Supply Chains — with a sharp Asia focus. Deep dives, counterintuitive analysis, breaking news & the real reasons behind the headlines. Run by SemiconductorsX | Daily updates →

Последний пост
15 июн.
Последнее чтение
13 авг.
Постов за неделю
0
Всего постов
13
Тип
открытый
Язык
английский
В каталоге с
13 авг.
Подписчики
9 173
−8 за 3 дн.
Сутки
−3
−0,03%
Неделя
 
Месяц
 
Просмотров на пост
1 302
12 постов
Вовлечённость
14,2%
к подписчикам
Постов в день
0,0
всего 13
Упоминаний
0
каналов
Охват размещения
оценка
1/24сутки в ленте
1/48двое суток
1/72трое суток

Оценка по просмотрам недавних постов: пост набирает почти всё за первые сутки.

Посты

  • 15 июн.1 37021

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  • 9 июн.1 509

    For latest news, follow on X https://x.com/SemiconductorsX

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  • Kioxia (285A.T) bouncing back strong today! Up ~2-6% to ¥73k-¥76k range after yesterday's dip, hitting ¥74k+ intraday on AI memory demand tailwinds. NAND/SSD boom for data centers keeps fueling it. #Kioxia #Semiconductors #AI

  • Samsung's chip recovery looks strong, but advanced packaging is the missing piece. Samsung's semiconductor business is bouncing back nicely thanks to HBM (shipments expected to triple this year) and foundry wins with names like Tesla, Nvidia, and xAI. However…

  • 9 июн.1 3251

    Samsung's chip recovery looks strong, but advanced packaging is the missing piece. Samsung's semiconductor business is bouncing back nicely thanks to HBM (shipments expected to triple this year) and foundry wins with names like Tesla, Nvidia, and xAI. However, in the key area of 2.5D advanced packaging, essential for combining high-end chips with HBM in AI accelerators, Samsung is still behind. Its own "Cube" tech has only seen small-volume shipments so far (mostly startups like Rebellions and short projects with IBM). No major hyperscaler AI accelerator wins yet. Meanwhile, TSMC is rapidly scaling CoWoS capacity, and Intel is pushing EMIB with Google's TPU. Samsung is shifting to Panel-Level Packaging (PLP) for better efficiency with larger chips and developing System-on-Panel (SoP) for even bigger integration. This could help Samsung catch up as AI chips keep growing in size.

  • 9 июн.1 4381

    Samsung’s foundry business has been struggling against TSMC. Landing more Nvidia work, especially on cutting-edge nodes, would be a major boost and help Samsung’s 2nm and future processes gain real momentum. For Nvidia, it means more supply chain options as demand stays insanely high. The whole AI ecosystem is tightening partnerships to scale faster. Samsung Foundry comeback story just got another positive signal.

  • Channel photo updated

Semiconductors, AI & Electronics — tgindex